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With the ability to directly solder the SoM onto the carrier card, the SoM ensures high levels of robustness and is ideal for products prone to vibrations. The System on Module is built on a 45mm x 45mm OSM Size-L standard with the provision for 662 contacts, offering the highest pin-to-area ratio across SoM standards.

Solderable LGA Package in OSM v1.1 Standard.

2-Lane MIPI-CSI and 4-Lane MIPI-DSI Interface.

NXP’s i.MX 93 SoC is the first in the industry to integrate the Arm® Ethos-U65 microNPU and the first in the i.MX Family to integrate the scalable Arm® Cortex®-A55 core features the latest Armv8-A architecture extensions with dedicated instructions to accelerate machine learning (ML).

Evaluation Kits of the System on Module will be ready to purchase in March 2023. The SoM incorporates NXP’s powerful i.MX 93 applications processor and is built on the OSM v1.1 solderable SoM standard, providing extensive interfaces in a rugged and compact form factor. IWave launches iW-RainboW-G50M: The Solderable NXP i.MX 93-based LGA System on Module (SoM).